Product Introduction:
To improve the detection efficiency of electronic component packaging modules, this equipment is a semi-automatic ultrasonic non-destructive testing device designed for electronic component packaging modules. It mainly detects delamination phenomena in packaging processes such as SOP/TSSOP/TO/PDFN/DIP. During the scanning process, it will not cause any damage to the products nor affect any of their performance.
Product Features
• Using a custom-developed high-resolution probe as the ultrasonic sensor, it can clearly present the internal details of the product.
• Equipped with a layered automatic coloring function.
• Can be equipped with an automatic product drying function.
• The scanned image of each product is stored to facilitate subsequent viewing of the scanned images or scanning records.
• It has the functions of A-scan, B-scan, C-scan, X-scan (multi-layer scanning) and Tray scan.
• For different products, scanning parameters and detection parameters are managed in the form of recipes, which facilitates customers to call them again with one click and avoids the need to set up various parameters repeatedly.
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