Ultrasonic Scanning Equipment - SAM120
Product Introduction:
In order to improve the detection efficiency of the power semiconductor industry, our company has developed a semi-automatic ultrasonic non-destructive testing equipment, which mainly targets the detection of voids or bubbles at the joints of various layers of packaged power devices (heat sinks and copper-clad laminates, upper and lower copper surfaces of copper-clad laminates and substrates, chips and upper copper surfaces), and performs automatic marking.











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