Ultrasonic Scanning Equipment - SAM325-Kunshan Zhongchuang Semiconductor Technology Co.,

Ultrasonic Scanning Equipment - SAM325

Product Introduction:

To improve the detection efficiency of automotive-grade HPD power packaging modules, our company has designed an ultrasonic non-destructive testing equipment. It is mainly used to detect voids or bubbles at the bonding interface between SiC modules and substrates, and perform automatic marking. Its design ensures that no damage is caused to the products during loading, unloading and scanning processes, and that none of the product's performance is affected.

Product Features

• Take the customized development disk as the vehicle to realize the automatic loading and unloading of products.

• It has the function of simultaneous imaging and inspection on both sides of the product during loading.

• It has the function of automatic product drying.

• Automatically mark the location of defects or the number of defects.

• Each product is marked to facilitate subsequent viewing of scanned images or records.

• Equipped with A-scan, B-scan, C-scan, X-scan (multi-layer scanning) and Tray scanning functions.

• For different products, scan parameters and detection parameters are managed in the form of formulas to facilitate customers' secondary one-click calls. Don't repeatedly establish various parameters.