Ultrasonic Scanning Equipment - SAM260-Kunshan Zhongchuang Semiconductor Technology Co.,

Ultrasonic Scanning Equipment - SAM260

Product Introduction:

To improve the screening efficiency of the ceramic copper-clad laminate industry, our company has designed a fully automatic ultrasonic non-destructive testing equipment. It is mainly used to detect voids or bubbles at the bonding interface between copper and ceramics in copper-clad laminates and perform automatic marking. The equipment will not cause any damage to the products during loading, unloading and scanning processes, and will not affect any performance of the products.

Product Features

• Using a flower basket as the carrier to realize automatic loading and unloading of products.

• Dual probes scan simultaneously, enabling imaging and inspection on both sides of the product without the need to flip the product.

• It has the function of automatic product drying.

• Equipped with a laser marker, it can automatically mark the location of defects or small pieces of defects.

• Each product is marked to facilitate subsequent viewing of scan images or records.

• Supports A-scan, B-scan, C-scan, X-scan (multi-layer scanning) and Tray scanning functions.

• For different products, scanning and detection parameters of various products are managed in the form of formulas, which facilitates customers to call them again with one click and avoids repeated parameter settings.