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Consumer Electronics

SMT Steel Mesh Inspection Machine

SMT Steel Mesh Inspection Machine

Product Characteristics:

• User-friendly interface: The intuitive and straightforward operation method, combined with optimized software algorithm design, make it more convenient for operators to use the equipment.

• Supports industry-standard PCB data formats: Gerber & ODB++, enabling offline import of drawings for analysis of electronic component elements. Different inspection standards can be set based on different components.

• Utilizes Singapore's specialized linear motors: Akribis high-precision magnetic levitation linear motors, combined with Renishaw ultra-precision grating scales from the UK and Hiwin high-precision linear slides from Taiwan, ensuring stable and smooth operation of the equipment.

• German Basler high-speed, high-resolution industrial cameras: Equipped with high-brightness light sources, the equipment achieves high-speed flying shooting. Coupled with a unique multi-threaded synchronous processing algorithm, it enables more efficient image analysis and detection, significantly improving inspection efficiency.

• Strong adaptability: Capable of inspecting various specifications of stencils, with a flexible recipe system suitable for different industrial application scenarios.

• Comprehensive measurement capabilities: Supports multiple measurement items, including hole area, dimensions, and foreign object detection, meeting diverse customer needs. The traceable measurement data system facilitates reverse tracing of process defects and control of process standards.

Product use

The system enables automated rapid defect measurement and pattern comparison analysis for patterned   production, significantly enhancing production efficiency and reducing labor costs compared to traditional manual inspection methods. It ensures that products meet high-quality standards, avoiding resource wastage caused by the use of inferior materials. It is applied in the precision evaporation of OLED organic light-emitting pigments for MASK, the ball mounting process of IC substrates, the printed electroforming templates/E-FAB for BGA 3D packaging, 3D PRINT FOFBGA, the ball mounting process for 4-12 inch semiconductor wafer-level packaging (WLP), covering BGA, WLCSP, Flipchip, Bumping, MEMS, MCM (MCP), WLP, SiP, TSV, Fan-Out chips, conventional chips and 5G chips, as well as high-precision electroformed nickel alloy meshes, etc.



Application Field

BGA ball placement process, SMT precision stencils, wafer-level ball mounting plates, quartz photomasks,  and micro-electroforming templates.

Technical Parameters

Technical Parameters

Equipment specificationsDetection accuracy
Gantry structureDual-Drive MarblePosition measurement accuracy3.45μm(One pixel)
Dynamic systemAkribis magnetic levitation linear motorDetection repetition accuracyGage R&R<3%
Computer systemWindows 10 22H2 ProAccuracy of moving position

Positioning  accuracy:±3μm

Repeated positioning accuracy:±2μm

Industrial computer brandAdvantech industrial computerMinimum measurement of single hole diameter20um
Overall size1450mm*1350mm*1650mm(Height does not include tri-color lights)Minimum measurement hole spacing100um
Weight1200KGMaximum measured diameter of single hole9mm
Test specificationsSoftware functions
Detection purposesSMT steel mesh incoming inspection or after cleaning inspectionMaterial number programming method

Off-line programming

Test itemHole area, position, offset, size, foreign object, burr, blocked hole, less hole, tension, expansion and contractionMain algorithmBy extracting MARK correction to calculate coordinate position, vector image algorithm was used to calculate the geometric position and size difference between main algorithm opening and actual Gerber
Tension detectionProgrammable Digital High-Precision Tension Meter with a Range of 5-60 N/cmCam formatRS-274X;ODB++
Frame size200 *200*15~~736*736*40(mm)Equipment test modeOffline testing
Maximum detection size620*620(mm)User permission managementSupports hierarchical management of rights
Detection speedCapture and Inspect FOV/0.7(S)MESSupport customized development
Optical systemBar code management function of steel mesh testing equipmentCustomer optional/software reserved port
CameraBasler 12 million pixelsGraph comparison functionBe equipped with
LensDouble telecentric lensInformation management systemFormulation system
Top IlluminationCoaxial lightHistorical recordThe test process and result data are recorded in files, and the test results can be viewed offline;
Bottom IlluminationHigh-Brightness Strobe BacklightTest mode

Multiple detection modes and test level settings; Different components can be grouped and graded separately to define and test;

Pixel accuracy3.45umSPC Data statisticsHistogram,Xbar-R Chart,Xbar-s Chart,Cp&Cpk,Daily/Weekly/Monthly Report
FOV size14.13mm*10.35mm(optional)


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